Samsung M393A4K40DB3-CWE 32GB DDR4-3200 RDIMM ECC-Registered Memory Module
  • Kategorie produktów:Zestaw pamięci
  • Numer katalogowy:M393A4K40DB3-CWE
  • Dostępność:In Stock
  • Stan:Nowy
  • Cechy produktu:Gotowy do wysyłki
  • Minimalne zamówienie:1 szt.
  • Cena katalogowa wynosiła:$199.00
  • Twoja cena: $129.00 Oszczędzasz $70.00
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Title

Samsung M393A4K40DB3-CWE 32GB DDR4-3200 RDIMM ECC-Registered Memory Module

Keywords

Samsung M393A4K40DB3-CWE, 32GB DDR4-3200 RDIMM, Dual-Rank x4 ECC Registered, PC4-25600 server memory, Samsung server DRAM, upgrade server memory, ECC Registered Module, buy M393A4K40DB3-CWE

Description

The Samsung M393A4K40DB3-CWE is a **32 GB** DDR4 memory module for servers, combining high capacity with robust error-correction and registered buffering for stability. Operating at **3200 MT/s** (PC4-25600), it fits in server environments where reliable performance and data integrity are critical. 

This DIMM features **ECC (Error-Correcting Code)** and is **registered (RDIMM)**, meaning it includes a register between the memory controller and the DRAM chips to buffer commands and addresses, which helps when populating multiple memory modules. Its **dual-rank x4** organization further enhances performance and compatibility in many server motherboards. 

Voltage is standard **1.2 V**, helping to reduce power consumption while maintaining high speeds. The form factor is **288-pin RDIMM**, suitable for enterprise servers and workstations that accept ECC registered DDR4 memory.

Although this particular module is listed as “discontinued (EOL)” on Samsung’s site, it remains widely available through third-party vendors and is useful for matching existing server memory configurations or for incremental upgrades. Compatibility should be checked based on the server’s memory population rules and the motherboard’s supported DIMM/rank structure. 

Key Features

  • 32 GB capacity, providing a balance of memory density for virtualization, database caching, or multi-user server workloads. 
  • DDR4-3200 (PC4-25600) speed ensures higher throughput compared to earlier DDR4-2666/2933 modules.
  • ECC Registered (RDIMM) module for enhanced stability and reliability under heavy server loads. 
  • Dual rank (2R) × organization x4, which means better rank interleaving and potentially improved bandwidth with compatible controllers.
  • Low operating voltage of 1.2 V for lower power consumption and heat. 
  • 288-pin RDIMM form factor, widely accepted in enterprise server platforms. 

Configuration

ComponentSpecification / Details
Part Number / SKUSamsung M393A4K40DB3-CWE
Capacity32 GB (1 × 32 GB module)
Memory TechnologyDDR4 SDRAM Registered (RDIMM)
Speed / Bandwidth3200 MT/s, PC4-25600
Rank & Organization2R (dual-rank) ×4
Voltage1.2 V
Form Factor / Pins288-pin RDIMM
Error CorrectionECC (error-correcting code)
Production StatusEnd of Life / Discontinued (EOL) by Samsung, but still stocked by resellers. 

Compatibility

This module is compatible with most server motherboards supporting DDR4-3200 RDIMM ECC memory, such as HPE ProLiant Gen10 / Gen10 Plus, Dell PowerEdge (latest generations), Lenovo ThinkSystem servers, Supermicro boards etc., but you should verify server BIOS support for 3200 MT/s and dual rank modules. Mixing different ranks or mixing RDIMM with LRDIMM / unbuffered memory may reduce performance or cause incompatibility. 

Check the server’s memory population guide: often memory speed drops when more than one DIMM per channel is used or when mixing with lower-speed modules. Ensuring matched module sets is best practice.

Usage Scenarios

1) Server Memory Upgrade: Ideal for boosting capacity in existing servers with available DIMM slots, especially when replacing smaller modules to reduce number of DIMMs and achieve required capacity. upgrade server memory

2) Virtualization Host / VM Density: With 32 GB per DIMM, multiple modules can yield high aggregate memory, supporting many VMs, container workloads, or memory-intensive apps. 32GB DDR4-3200 RDIMM

3) High-Performance Database or In-Memory Analytics: Dual rank ×4 organization helps with bandwidth; coupled with high speed and ECC, useful for caching, in-memory tables, or buffer pools. PC4-25600 server memory

4) Enterprise / Cloud Infrastructure: For cloud providers, data centres, or hosting where memory reliability (ECC) and density are key; these modules help reduce overhead per rack unit, power, and cost per gigabyte.

5) Workstation / HPC Boot / CUDA Nodes: Where servers or compute nodes need moderate high memory per node but high throughput, this module provides solid performance with lower latency, error correction, and registered stability.

Frequently Asked Questions

  1. Q: Can this module operate at full 3200 MT/s in all server slots?
    A: Not always. When multiple DIMMs per channel are used, or with older memory controllers, BIOS may drop speed to 2933, 2666 or lower. Always check the motherboard / server’s specs and memory population guide. Mixed-rank or mismatched modules may cause lower speeds.
  2. Q: Is “Dual-Rank x4” better than single-rank or x8 in server RAM?
    A: Dual-Rank (2R) modules often allow better memory interleaving and higher performance under load if the memory controller supports it. The x4 chip organisation means each internal chip has 4 data bits width, often allowing more chips per rank, possibly affecting refresh or power, but for most enterprise uses it gives a good trade-off.
  3. Q: Can I mix this RDIMM module with other RDIMMs of different capacity or ranks?
    A: Mixing is possible but not ideal: same speed, voltage, ECC type must match; mixing ranks can lead to reduced speed. It’s safer to use matched modules in each channel for consistent performance.
  4. Q: Since it is “discontinued (EOL)”, is that a problem for support or warranty?
    A: Being EOL means Samsung may no longer produce it, and warranty terms may differ per vendor. However, many resellers still have stock. For support, ensure module certificate or reseller warranty; verify return policies. Using EOL memory in systems is usually safe if specs are met.
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